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Semiconductor ceramic

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Package Ceramic Arm For Semiconductor

Brand：Mingrui Ceramic
Material：Alumina Zirconia...
Precision：±0.001mm
Features：High precision electric insulation
Color：Can be customized
Customized：Mingrui ceramics can be customized according to customer requirements

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Package Ceramic Arm For Semiconductor

Package Ceramic Arm semiconductor Ceramic parts from the powder, sintering, molding, post-processing of a series of procedures completed by the factory.

Package Ceramic Arm Can process various specifications of ceramic arms, suitable for 2 ", 4 ", 6 ", 8 ", 12 ".
we can be processed according to drawings or samples.

Compared with the metal mechanical arm, Package Ceramic Arm has a moisture resistance, high temperature resistance, expansion, corrosion resistance, wear resistance.Package Ceramic Arm Can be customized according to user requirements.

Package Ceramic Arm Application:
heavy load handling manipulator/automatic glue dispensing, locking screw, grasping loading and unloading equipment

Manufacturing Precision:
Ceramic Arms precision machining size up to ±0.001mm, the narrowest can be machined groove width 0.1x100mm, linear tolerances up to 0.001mm, cylindrical up to 0.004mm.

Materials parameter:

Property	Alumina	Property	Zirconia
Bulk density(g/cm3)	3.85-3.93	The density (g/cm3)	6.05
Hardness(HRA≥)	86	Bibulous rate(%)	0
Bending strength（Mpa≥）	300	Thermal expansion coefficient(10-6 /k)	10.5
Maximum service temperature（℃）	1500	Young's modulus of elasticity(Gpa)	210
Linear expansion coefficient（×10-6/℃）	7.15-7.67	Poisson's ratio(/)	0.3
Dielectric constant（εr(20℃,1MHz)）	9.21	Hardness (MPa)	1200
Dielectric loss（tanδ×10-4,1MHz）	2.5	Bending strength (MPa)	950
Volume resistivity（Ω·cm(100℃)）	9.2*1016	The bending strength (MPa)	210
The compressive strength（Mpa≥）	2500	Compressive strength (MPa)	2000
Flexural strength（Mpa≥）	200	Fracture toughness(Mpa.m1/2)	10
Modulus of elasticity（Gpa）	300	Thermal conductivity (W/m.k)	2
Poisson's ratio	0.2	Specific resistivity(Ω.mm2/m)	＞1015
Thermal conductivity Coefficient(W/m·K(20℃))	20	Maximum service temperature(℃)	1350
Dc breakdown strength	43.7	Acid and alkali corrosion resistance(/)	strength
Tensile seal strength(Mpa)	104.4

Dimensional accuracy	Up to 0.001mm
Smoothness	Highest possible mirror
Concentricity	Up to 0.003mm
Parallelism	Up to 0.002mm
The inner hole tolerance	The minimum 0.005mm
Straight flute	The narrowest 0.1x100mm
The thickness of the size	Minimum to 0.02mm
The screw thread	Minimum internal thread M2
Cylindricity	Up to 0.004mm
The linear tolerance	Up to 0.001mm
The smallest aperture	The minimum 0.07mm
Visual quality: 1. No cracks, no dark dots, no contamination and sharp edges; 2. Evenly distributed glaze with very smooth surface

Properties :

1. High Hardness wear resistance
2. High precision
3. Good mechanical strength
4. High temperature and chemical resistance
5. Electric insulation
6. Low thermal expansion
7. Smooth surface finish
8. Thermal Shock Resistance

Material :

1. Alumina ceramic
2. Zirconia ceramic
3. Silicone carbide
4. Silicone nitride
Lead-time: 20-30 days for mass production, 7-15 days for samples.

Package Ceramic Arm For Semiconductor

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