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Ceramic substrates high precision machinale technical ceramic substrates for industry

Brand：Mingrui Ceramic
Material：Alumina Zirconia Si3N4 SiC
Precision：+/-0.003mm
Features：refractoryheat conductive
Color：Can be customized
Customized：Mingrui ceramics can be customized according to customer requirements

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Ceramic Substrates High Precision Machinale Technical Ceramic Substrates For Industry

Ceramic substrate refers to the copper foil at high temperature directly bonded to aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate surface (single or double) on the special process board.The ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent soft soldering and high adhesion strength, and can be like PCB board can be etched out of a variety of graphics, with great current-carrying capacity.Therefore, ceramic substrate has become the basic material of high power electronic circuit structure technology and interconnection technology.

Part of ceramic substrates available specifications:

Length (inch)	Thickness (inch)	Width (inch)
0.75	0.165	0.63
0.875	0.187	0.227
0.975	0.2	0.312
1	0.39	0.25
1	0.177	0.75
1	0.5	0.75
1.17	0.23	0.355
1.875	0.187	0.875
1.875	0.387	0.875
1.875	0.387	0.875
2.95	0.5	0.95
3	0.125	2
6	0.25	4

The above substrate specifcation is a machinable case from us ,for the special sizes of substrate will be customized.

Advantage of ceramic substrate:
1. The thermal expansion coefficient of the ceramic substrate is close to that of the silicon chip, which can save the transition layer Mo chip, save labor, material and cost;

2. Reduce the welding layer, reduce the thermal resistance, reduce the void, improve the yield;
Under the same current-carrying capacity, 0.3mm thick copper foil wire width is only 10% of the ordinary printed circuit board;

3. Excellent thermal conductivity, so that the chip package is very compact, so that the power density is greatly improved, improve the reliability of the system and device;

4. Ultra-thin (0.25mm) ceramic substrate can replace BeO without environmental toxicity;

5. Continuous mixer carrying capacity is big, 100 a current by 1 mm width 0.3 mm thick copper body, the temperature is about 17 ℃;100 a current for 2 mm wide by 0.3 mm thick copper body, only the temperature of 5 ℃ or so;

6. Low thermal resistance: the thermal resistance of the 10 10mm ceramic substrate is 0.63mm /W, 0.38mm /W and 0.14k /W respectively.

7. High insulation and high voltage, to ensure personal safety and protection of equipment.

Applications of the ceramic substrate:
1. High-power power semiconductor module;Semiconductor refrigerator and electronic heater;Power control circuit, power hybrid circuit.
2. Intelligent power module;High frequency switching power supply, solid state relay.
3. Automotive electronics, aerospace and military electronic components.
4. Solar panel components;Telecommunication private exchange, receiving system;Laser and other industrial electronics.

Ceramic material composition:
· 95%--99.99% Alumina (Al2O3) · Silicon Carbide · Silicon Nitride
· TTZ: Magnesia partially stabilized Zirconia (ZrO2)
· YTZP: Yttria partially stabilized Zirconia (ZrO2)
· ZDY: Yttria fully stabilized Zirconia (ZrO2)

ceramic substrate precision process:

Precision of manufacture
Dimensional accuracy	Up to 0.001mm
Smoothness	Highest possible mirror
Concentricity	Up to 0.003mm
Parallelism	Up to 0.002mm
The inner hole tolerance	The minimum 0.005mm
Straight flute	The narrowest 0.1x100mm
The thickness of the size	Minimum to 0.02mm
The screw thread	Minimum internal thread M2
Cylindricity	Up to 0.004mm
The linear tolerance	Up to 0.001mm
The smallest aperture	The minimum 0.07mm
Precision process	CNC maching,grinding,lapping
Surface finish	Glazed,polishing or metallized
Visual quality: 1. No cracks, no dark dots, no contamination and sharp edges; 2. Evenly distributed glaze with very smooth surface

Raw materials-Molding process - Sintering - Machining & Grinding - Quality Inspector

Ceramic Parameter:

Properties	Units	AL2O3	ZrO2	SiC	Si3N4
Density	g/cm3	3.65-3.93	5.95-6.0	3.12	3.23
Water absorption	0	0	0	0	0
Coefficientof thermal expansion	10-16/k	7.9-8.5	10.5	3	3.2
Modulus of elasticity young`s mod	GPa	280-340	210	440	300
Poission`s ratio	/	0.21-0.22	0.3	0.17	0.26
HV hardness hv	MPa	1650	1300-1365	2800	1500
Flexural strength	MPa	310	950	390	720
Flexural strength(700℃)	MPa	230	210	380	450
Compressive strength	MPa	2200	2000	1800	2300
Fracture toughness	MPa*m1/2	4.2	10	3.9	6.2
Heat conductivity	W/m*k	26-30	2-2.2	120	25
Electrical resistivity	Ω*mm2/m	>1016	>1015	>103	>1013
Max use temperature	℃	1750	1050	1550	1050
Resistance to acid alkaline	/	high	high	high	high
Dielectric constant	/	9.6	29	9.66-10.03	/
Dielectric strength	KV/mm	8.7	9	/	/
Thermal shock resistance	△T（℃）	180-220	280-350	230-260	/
Tensile strength	MPa	248	250	/	/

Customization & Machining Service：
As a professional manufacturer of industrial ceramic components.We can custom the sepcial specifications of ceramic substrate or other ceramic parts.High quality,Factory price, on-time delivery, High composition of ceramics

For more information about ceramics parts,please contact our engineers in time >>>

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