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Ceramic Technology
Advantages and Applications of Alumina Ceramic Substrate
Time: 2021-11-09   Writer: Mingrui Ceramics
Alumina is a well-known and commonly used precision ceramic material. For decades, it was once used in electrical components due to its high electrical insulation. Because of its high strength, high corrosion resistance and high wear resistance, it is widely used in our lives. Because alumina is a material with relatively balanced mechanical performance parameters, alumina has a wide range of applications, including wear-resistant products used in high-temperature industrial furnaces and various electronic components.
 
Alumina Ceramic Substrate
Alumina Ceramic Substrate
 
Due to stable chemical and physical properties, alumina ceramic substrate is widely known as a precision ceramic material.
Thermal characteristics: strong heat resistance and thermal conductivity
Mechanical properties: high strength and hardness
Other features: high electrical insulation, strong corrosion resistance, and high biocompatibility.
 

Application fields of alumina ceramic substrate

 
◆LED power lighting.
 
◆High-power power semiconductor modules: semiconductor refrigerators, electronic heaters.
 
◆Power control circuit, power mixing circuit.
 
◆Intelligent power components: high-frequency switching power supplies, solid state relays.
 
◆Automotive electronics, aerospace and military electronic components.
 
◆Solar panel components: telecommunications dedicated switches, receiving systems, lasers and other industrial electronics.
 
Stone DPC alumina ceramic circuit board has the following advantages
 
 
Low communication loss-the dielectric constant of the ceramic material itself makes the signal loss smaller.
 
High thermal conductivity-the thermal conductivity of alumina ceramics is 15-35 w/mk, and the heat on the chip is directly conducted to the ceramic sheet without an insulating layer, which can achieve relatively better heat dissipation.
 
More matching thermal expansion coefficient-chip material is generally Si (silicon) GaAS (gallium arsenide), the thermal expansion coefficient of ceramic and chip is close, and will not produce too much deformation when the temperature difference changes drastically, causing problems such as wire unsoldering and internal stress.
 
High bonding strength-The bonding strength between the metal layer and the ceramic substrate of the Stone ceramic circuit board product is high, and the maximum can reach 45MPa (more than 1mm thick ceramic sheet itself).
 
Pure copper through-holes-Stone ceramic DPC process supports PTH (plated through holes) / Vias (vias).
 
High operating temperature-ceramics can withstand high and low temperature cycles with large fluctuations, and can even operate normally at high temperatures of 500-600 degrees.
 
High electrical insulation-The ceramic material itself is an insulating material and can withstand a high breakdown voltage.
 
Customized service-Mingrui ceramics ceramic substrate manufacturers can provide customized services according to customer needs, and mass production according to product design drawings and requirements given by users. Users can have more choices and be more humane.

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