Aluminum Nitride (AlN) Material Properties

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Aluminum Nitride (AlN)

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Aluminum Nitride (AlN) Material Parameters
Aluminum Nitride ceramic material is an advanced ceramic material with aluminum nitride (AlN) as the main crystal phase. It has a hexagonal wurtzite crystal structure, which gives it excellent thermal conductivity and electrical insulation, making it excellent in high temperature, high power and harsh environments, and making it widely used in many high-tech and industrial fields. Physical and chemical properties · High thermal conductivity: The thermal conductivity is 140-180 W/(m·K), which is about 5-8 times that of aluminum oxide (Al₂O₃), close to metal aluminum, but also has electrical insulation. · Low thermal expansion coefficient: about 4.5×10⁻⁶/°C, close to silicon (3×10⁻⁶/°C), reducing thermal stress in semiconductor packaging. · Excellent electrical insulation: resistivity>10¹⁴ Ω·cm, stable at high temperatures. · Chemical stability: resistant to high temperature oxidation (up to 1400℃), resistant to molten metals (such as aluminum and copper), and resistant to acid and alkali corrosion. · Mechanical properties: high hardness (Vickers hardness of about 1200 HV) and bending strength (300-400 MPa), but low toughness (about 3 MPa·m¹/²).

Performance advantages

· Efficient heat dissipation: solve the heat dissipation problem of high-power devices and extend life.

· Thermal matching: compatible with semiconductor materials, reducing the risk of package interface failure.

· High temperature reliability: maintain performance at extreme temperatures, suitable for aerospace.

· Versatility: has thermal conductivity, insulation, and corrosion resistance, and adapts to complex working conditions.

Application fields

Due to its excellent performance, aluminum nitride ceramics have been widely used in many fields:

1. Electronic industry:

· Packaging heat dissipation substrate: The high thermal conductivity and low thermal expansion coefficient of aluminum nitride ceramics make it an ideal packaging heat dissipation substrate for high-performance integrated circuits, power semiconductor devices, high-power LEDs, etc.

· Semiconductor equipment parts: such as electrostatic chucks, aluminum nitride heating plates, ceramic nozzles, high-temperature corrosion-resistant parts, etc.

2. Cutting tools and molds: The high hardness and wear resistance of aluminum nitride ceramics make it an ideal material for manufacturing high-precision cutting tools and molds.

3. Aerospace: Used to manufacture wear-resistant, heat-dissipating and insulating parts in high-temperature environments, such as nozzles and heat sinks of jet engines.

4. Gas turbines: Manufacture parts in high-temperature, high-pressure and corrosive environments, such as turbine blades, combustion chambers, etc.

5. Optical field: Pure aluminum nitride ceramics have excellent optical properties and can be used to manufacture optical parts such as infrared windows and fairings.

6. Thermal conductive fillers: Added to resins or plastics as thermal conductive fillers to improve the thermal conductivity of the material.

Aluminum nitride ceramic materials, with their excellent properties such as high thermal conductivity, low thermal expansion coefficient, good electrical properties and chemical stability, have shown great application potential in the electronics industry, cutting tools, aerospace, gas turbines, optics, etc. In particular, aluminum nitride ceramics will play a more important role in emerging industries such as new energy vehicles, 5G communications, and the Internet of Things.

Aluminum Nitride (AlN) Material Parameters

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