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Custom Precision Zirconia Ceramic Component for Photovoltaic
- Materials：Alumina (Al2O3)/ Zirconia(ZrO2) /Si3N4 /SiC ...etc
- Sizes：Custom according to the drawings
- Delivery times：2 -25 days(depends on the quantity)
- Precision：Ra 0.1um tolerance: 0.001mm... etc
- Features：Heat resistance / Wear resistance / High purity / Refractory / High Corrosion / Good Insulation
Custom Precision Zirconia Ceramic Component for Photovoltaic
To reduce and/or eliminate damage to wafers during the process steps and during transport to and from the various devices, the wafers are carried on carrier devices or [Ceramic wafer carrier ". The wafer boats are necessarily subjected to the same corrosive chemicals and/or high temperatures under which the wafers are processed. In addition, after wafer processing, the wafer boats are themselves subjected to chemical cleaning processes to remove any particulates and/or other impurities to avoid contamination of any subsequent wafer batches.
Formats of various Ceramic wafer carrier are well know in the art and may differ depending on the size and nature of the wafer (e.g., diameters ranging from 100 mm to 500 mm and thicknesses of about 0.15 to about 1.5 mm) and/or the structures of the processing equipment into which the wafers are placed. For example, horizontal wafer boats are used in processes that involve horizontal oxidation furnaces, and vertical wafer boats in processes that involve vertical furnaces.
In conventional practice, a Ceramic wafer carrier is fabricated from a single material. In part this had been considered necessary to eliminate the possibility of a high movement of tolerances under the extreme temperature and chemical conditions, which would result in damage to the boat and/or, more significantly, cause damage to the wafers that are carried on the boat.
Materials:
Us can be based on customer drawings and requirements to provide non-standard ceramic accessories and provide related solutions.
To reduce and/or eliminate damage to wafers during the process steps and during transport to and from the various devices, the wafers are carried on carrier devices or [Ceramic wafer carrier ". The wafer boats are necessarily subjected to the same corrosive chemicals and/or high temperatures under which the wafers are processed. In addition, after wafer processing, the wafer boats are themselves subjected to chemical cleaning processes to remove any particulates and/or other impurities to avoid contamination of any subsequent wafer batches.
Formats of various Ceramic wafer carrier are well know in the art and may differ depending on the size and nature of the wafer (e.g., diameters ranging from 100 mm to 500 mm and thicknesses of about 0.15 to about 1.5 mm) and/or the structures of the processing equipment into which the wafers are placed. For example, horizontal wafer boats are used in processes that involve horizontal oxidation furnaces, and vertical wafer boats in processes that involve vertical furnaces.
In conventional practice, a Ceramic wafer carrier is fabricated from a single material. In part this had been considered necessary to eliminate the possibility of a high movement of tolerances under the extreme temperature and chemical conditions, which would result in damage to the boat and/or, more significantly, cause damage to the wafers that are carried on the boat.
Materials:
| Property | Alumina | Property | Zirconia |
| Bulk density(g/cm3) | 3.85-3.93 | The density (g/cm3) | 6.05 |
| Hardness(HRA≥) | 86 | Bibulous rate(%) | 0 |
| Bending strength（Mpa≥） | 300 | Thermal expansion coefficient(10-6 /k) | 10.5 |
| Maximum service temperature（℃） | 1500 | Young's modulus of elasticity(Gpa) | 210 |
| Linear expansion coefficient（×10-6/℃） | 7.15-7.67 | Poisson's ratio(/) | 0.3 |
| Dielectric constant（εr(20℃,1MHz)） | 9.21 | Hardness (MPa) | 1200 |
| Dielectric loss（tanδ×10-4,1MHz） | 2.5 | Bending strength (MPa) | 950 |
| Volume resistivity（Ω·cm(100℃)） | 9.2*1016 | The bending strength (MPa) | 210 |
| The compressive strength（Mpa≥） | 2500 | Compressive strength (MPa) | 2000 |
| Flexural strength（Mpa≥） | 200 | Fracture toughness(Mpa.m1/2) | 10 |
| Modulus of elasticity（Gpa） | 300 | Thermal conductivity (W/m.k) | 2 |
| Poisson's ratio | 0.2 | Specific resistivity(Ω.mm2/m) | ＞1015 |
| Thermal conductivity Coefficient(W/m·K(20℃)) | 20 | Maximum service temperature(℃) | 1350 |
| Dc breakdown strength | 43.7 | Acid and alkali corrosion resistance(/) | strength |
| Tensile seal strength(Mpa) | 104.4 |
|
Properties :
1. High Hardness wear resistance
2. High precision 3. Good mechanical strength 4. High temperature and chemical resistance 5. Electric insulation 6. Low thermal expansion 7. Smooth surface finish 8. Thermal Shock Resistance Material :
1. Alumina ceramic
2. Zirconia ceramic 3. Silicone carbide 4. Silicone nitride Lead-time: 20-30 days for mass production, 7-15 days for samples. |
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Dongguan Mingrui Ceramic Technology Co., Ltd.
TEL：+8618122974730
MB：+86 181 2297 4730 Tel：+86 746 3386888
Skype：+86 181 2297 4730
Email：admin@cerampart.com
ADD：No. 21, Chuangxing Road, Shangsha Second Industrial Zone, Chang'an Town, Dongguan City
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